DIC – Digital Image Correlation
Digital Image Correlation (DIC) is a 3D, full-field, non-contact optical technique to measure contour, deformation, vibration and strain on almost any material. The technique can be used for many tests including tensile, torsion, bending and combined loading for both static and dynamics applications. The method can be applied from very small (micro) to large testing areas – and the results are readily comparable with FEA results or strain gauges.
Features :
3D Full-field, Real-time display of displacement and strain overlaid on live image
Real-Time Correlation with analog voltage output – evaluate, display and output data in real-time for interfacing with other equipment
Multi-camera system for up to 360 degree measurement around an object and simultaneous front and back side measurements (thinning)
Measurement area <1mm up="" to= several square meters"">1m
Fast and easy automatic calibration procedure.
Online feedback of accuracy and quality.
All data with a confidence margin (error approximation).
Full access to data using an open data format .
Synchronous recording of analog data .
Extended export and import - to FEA software for comparisons .
Different coordinate systems .
High speed cameras up to 1,000,000 frames/sec .
 
Contour, Deformation and Strain Measurement
 
Q-400 - DIC Standard 3D
For 3D shape, displacement and strain measurement
Q-480 - DIC Handheld
For 'point & shoot' displacement and strain measurement
Q-400 - µDIC
For microscopic thermal expansion and warpage measurement
Q-400 DIC TCT
For thermal expansion, strain and warpage measurement
 
     
Q-450 - DIC High-Speed
For vibration measurement
     
 
Videoextensometer - Real Time Strain Sensor
 
Learn more about DIC
Measurement Principles
Digital Image Correlation (DIC) is a full-field image analysis method, based on grey value digital images, that can determine the contour and the displacements of an object under load in three dimensions. Read More
 
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